MDPspot

Low cost tabletop single spot measurements on wafers or bricks.

Tabletop single spot measurements

Low-cost tabletop lifetime measurement system for characterization of a variety of different silicon samples at different preparation stages, without built-in automatization. Optional hand operated z-axis for thicker samples up to 156 mm bricks. Standard software for result visualization.

MDPspot w
Includes an additional resistivity measurement option. Resistivity measurements for silicon only, either for wafers without height adjustment possibility, or for bricks. One of these two options has to be predefined.

Facts

contactless destruction free electrical semiconductor characterization
μ-PCD measurement option included
advanced sensitivity for visualization of so far invisible defects and investigations of epitaxial layers
integration of up to four lasers for a wide range of injection levels
access to primary data of single transients as well as maps for special evaluation purposes

Add-ons

Spot size variation
Resistivity measurement (wafers)
Background/Bias light
Reflection measurement (MDP)
Software extension
Additional lasers

Advantages

Tabletop unit for single point measurements of carrier lifetime, multi- or mono-crystalline silicon at different preparation stages, from as- grown up to final devices.
Small size, low cost and easy to use. Comes with a basic software for result visualization on a small PC or notebook.
Suitable for wafers up to bricks, with easy to handle height adjustment.

Technical specifications

	mono or multi silicon wafers, bricks, cells, wafers after different processing steps like passivation or diffusion
sample size	above 50 x 50 mm² up to 12“or 210 x 210 mm²
resistivity	0.2 - 10³ Ohm cm
material	silicon wafers, bricks, partially or fully processed wafers, compound semiconductors and beyond
measurable properties	carrier lifetime
dimension	360 x 360 x 520 mm, weight: 16 kg
power	110/220 V, 50/60 Hz, 3 A

Detail

allows for single wafer investigation
different recipes for different wafer classes
monitoring of material, process quality and stability